Yikuphi okubonakalayo okwenziwe yi-PCB?
Mar 08, 2023
Izinto eziphambili ezisetshenziswa yi-PCB Circuit Board iyipuleti ye-CRAP CLAD, nazo zingabizwa ngokuthi i-substrate, zenziwa ngephepha le-Wood Pulp noma i-Resin Foil, umkhiqizo wokucindezela okushisayo. Njengamanje, ipuleti le-clop clad lalinikelwa emakethe, kusukela ekucabangeni okuphansi, kungahlukaniswa ikakhulu kulezi zigaba ezilandelayo: I-Paper substrate, i-fiber fiber futterterate, indwangu yendwangu engafakwanga, indwangu yendwangu evunyelwe.
I-substrate yipuleti elifakwayo elifaka ama-polymer sonthetic resin nezinto eziqinisiwe. Ingaphezulu le-substrate limbozwe ngesendlalelo sokuvuselelwa okuphezulu, ukunqotshwa okuhle kwe-foil ye-foil emsulwa, ubukhulu obuvame kakhulu buka-35 ~ 5 0 \/ ma; I-foil ye-copper embozwe ohlangothini olulodwa lwe-substrate libizwa ngokuthi yiplate elihlangene elinye, izinhlangothi zombili ze-substrate zethuka nge-topper foil yethusi clad plate libizwa ngokuthi yipuleti elihlangene ne-COPPER CLAD; Ukuthi i-foil yethusi ingambozwa ngokuqinile ku-substrate iqediwe ukunamathela. Ukuqina okuvame ukusetshenziswa kwe-clad clad crad of 1. {0 mm, 1.5mm ne-2.0mm izinhlobo ezintathu.
